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Leadframe SystemsFlexible Printed CircuitsIndustrial AutomationOther Semicon Products
Leadframe SystemsFlexible CircuitsIndustrial AutomationOther Semicon Products

   
Leadframe Systems
 
- Leadframe Taping
- QFN Leadframes
- Reel-to-Strip Downset
- Strip-to-Strip Dwonset
Industrial Automation

 

 
Leadframe Systems
Leadframe Taping
 
Leadframe Taping Machine
 
   
Features
 
- Reel to Strip or Strip to Strip
-
Available Taping configuration: > 2/4 Segment Taping
  > Window Taping
- Option for single row, 2 row and matrix taping
- All Taping and Post-Curing modules are supported by 4 posts.
- Servo Driven feeder for reel form operation
- Linear clamp feeding system for strip form operation
   
Overview
 

A variety of different taping configuration is available.

Scrap less taping for segment taping so there is no wastage of tape.

Window taping is by means of punch out method. Feeding is design such that there will be minimal wastage of tape material.

Options for full Taping with downset and autostacker system or single Taping module.

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QFN Leadframes
 
Lamination Equipment for QFN/MLP Leadframes (Model: SC-QFN-01)
 
   
Features
 
- Automatic pick & place module
- Auto Frame position preciser
- NC servo controlled transport
- Precision lamination process by means of NC servo
- Small footprint
- Ideal for small lot or prototype run
   
Overview
 

Automatic loading and unloading by means of pick and place. Frame position is guaranteed by means of automatic preciser. Transport and lamination process utilizes high precision servo motion.

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A BasicElement Design